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School of Electrical and Electronic Engineering

Device Processing and Fabrication

Below are some of the facilities we currently have available for device processing and fabrication:

bonders

Bonders (x2)

 

 

 

 

 

 

 

 

 

Sputtering

Sputtering

 

 

 

 

 

 

 

 

 

 

Thermal Evaporation

Thermal Evaporation (x6)

 

 

 

 

 

Plasma Etching and Deposition

Plasma Etching and Deposition

 

 

 

 

 

SEM

SEM and EBL

 

 

 

 

Wafer Scriber

Wafer Scribers

 

 

 

 

 

Mask Aligner

Mask Aligners (x3): up to 4" capability

 

 

 

 

 

 

 

 

 

 

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